Brand: SIZZIX
MODEL: SIZ660513
Sizzix Die Brush & Foam Pad for Wafer Thin Dies
Same-day to 2-day delivery
Check availability in store
Please enable your browser location services in order for us to help you get personalized store listing based on your current location. Alternatively, you may proceed to choose store from list or search for your favorite store.
Store finder
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
Die Brush: 5 1/2" x 1 3/4" x 1/4"
Foam Pad: 4 1/2" x 7 1/4"
Die Brush: 5 1/2" x 1 3/4" x 1/4"
Foam Pad: 4 1/2" x 7 1/4"
100.0
200.0
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
Die Brush: 5 1/2" x 1 3/4" x 1/4"
Foam Pad: 4 1/2" x 7 1/4"
Die Brush: 5 1/2" x 1 3/4" x 1/4"
Foam Pad: 4 1/2" x 7 1/4"
View full description
View less description
Customers